VeriPac
The VeriPac 225/BLV inspection system evaluates and analyzes blister package integrity with precision and repeatability.
The core technology of the VeriPac 225/BLV is based on an ASTM approved vacuum decay leak test method that was developed using VeriPac instruments, with the addition of special vision imaging technology to easily identify the location of defective blister cavities.
The VeriPac 225/BLV provides non-destructive, non-invasive inspection of multi-cavity blister packaging made with any material, flat or glossy finish, printed or non-printed surface.
Each test cycle is rapid with test results available in numerical, statistical and image formats.