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Non-Destructive Technology for Blister Package Testing

03-29-2016

Bring blister pack samples to our booth for testing!

Tuckahoe, New York (April, 2016) – PTI Inspection Systems will introduce a new technology platform to test blister packaging at Interphex, April 26-28, at the Jacob Javits Convention Center in New York City, Booth 3717.

The VeriPac UBV Leak Detection System is a deterministic non-destructive technology designed specifically for multi-cavity blister packs. The VeriPac UBV utilizes volumetric imaging under vacuum to detect the presence of leaks. It’s a simple, rapid 3-step process to test a blister pack. Operators follow these 3 steps:

  1. Input number of blister cavities
  2. Place the blister pack on the inspection plate
  3. Press the START button

Within seconds, the operator sees a definitive pass/fail result, along with a volumetric measurement reading. The location of the defective cavity is also identified. This technology is unique in that it can provide rapid detection of defects as small as 10 microns in a test cycle of less than 15 seconds using no tools or test parameter changes.

We invite customers to bring their blister pack samples to Interphex, and we’ll test their samples right in the booth.

Benefits:

  • Non-destructive technology
  • Accurate and repeatable results
  • Qualitative pass/fail and quantitative test result data
  • Completely tool-less
  • Fast changeover to test different blister formats
  • Identifies which cavity is defective
  • Eliminates destructive, subjective testing methods

Contact PTI for more information:

Michelle Wolf: 973-252-6039/973.479.8626      m.wolf@ptiusa.com

Jesse Sklar: 914.337.2005         j.sklar@ptiusa.com

Oliver Stauffer : 914.337.2005   o.stauffer@ptiusa.com

PTI Inspection Systems: www.ptiusa.com