HOME / BLISTER PACKAGING / Blister packaging inspection solutions

Blister Package Inspection Technologies

PTI’s non-destructive inspection technologies for seal and leak detection of blister packs, sachets, and pouches with low headspace. Deterministic quantitative test methods:

VeriPac UBV Universal Blister Verification

  • Applications for multi-cavity blister packaging
  • Tool-less design with no changeover for different format blisters
  • Volumetric imaging technology under vacuum

VeriPac 410 for all low headspace packaging

  • Applications include blisters, sachets and transdermal patch packaging
  • Vacuum decay and differential force measurement technology